A powerful in-house capability
DELTA operates its own in-house semiconductor failure analysis department.
We have a very large investment in specialised equipment for the task, from mechanical access techniques to X-ray and scanning electron microscope examination.
Troubleshoot problems quickly
This analysis capability ensures that we are able to quickly get to the root cause of any problem, whether the aim is to keep a microelectronic or ASIC project on track, or to troubleshoot problems that have developed during operational service.
Among the issues we can quickly and efficiently resolve are:
Is a failure due to some aspect of the IC fabrication process?
Is a failure caused by the operating conditions?
Is a failure related to a design weakness?
These specialist services are widely used by commercial IC manufacturers and IC users, and by our own in-house IC developers.
Learn more from 5 different case studies.
DELTA also has access to other specialised equipment such as FIB material deposition, via a network of partners.
Semiconductor Failure Analysis techniques
Microsectioning
Real time X-ray
Hot spot analysis
Solderability tests
Sub-micron probing
Chemical and plasma etching
Scanning electron microscopy
Scanning acoustic microscopy
Energy dispersive analysis of X-ray
Gross and fine leak hermeticity testing
Bright/dark field, differential interference, light sectioning, and stereo microscopy
Environmental testing (temperature, shock, humidity, corrosion, vibration)
X-ray view
SAM image
SEM image deepness